Oppo has confirmed that its upcoming Find X9 lineup will soon reach Indian stores, following a separate launch already locked in for China on October 16. The company plans to expand availability by November, suggesting a broader showcase event could take place between both rollouts, hinting at a global introduction before the year ends.
| Image credit: Oppo
- Oppo’s Find X9 series launches in China on October 16, with India availability set for November.
- The Find X9 lineup debuts MediaTek’s new Dimensity 9500 chip, making Oppo the first to use it.
- Dimensity 9500 offers 17% faster CPU performance with lower power consumption and better efficiency.
- The Find X9 series adds advanced cooling for stable performance during heavy gaming or long sessions.
- Oppo and MediaTek’s partnership positions both brands as leaders in next-gen Android performance heading into 2025.
Oppo has confirmed that its upcoming Find X9 lineup will soon reach Indian stores, following a separate launch already locked in for China on October 16. The company plans to expand availability by November, suggesting a broader showcase event could take place between both rollouts, hinting at a global introduction before the year ends.
During the India Mobile Congress, MediaTek and Oppo jointly revealed that the Find X9 range will debut with the new Dimensity 9500 processor under the hood. This collaboration gives Oppo the distinction of being first to market with the flagship chipset, which MediaTek unveiled just weeks earlier in late September. The move positions both brands at the forefront of next-generation mobile performance.
At the heart of the Dimensity 9500 lies MediaTek’s latest third-generation All-Big-Core setup. The prime core reaches speeds of 4.21 GHz, and the company claims noticeable boosts across both speed and efficiency. Early figures suggest CPU performance sees roughly a 17 percent gain, while maximum power draw has been drastically cut, offering a more balanced performance curve.
Graphics handling also takes a leap forward with the ARM G1-Ultra GPU, which is expected to outperform its predecessor by around a third while demanding substantially less energy. This makes the chip particularly suitable for gaming and multimedia-heavy workloads without the same heat buildup associated with previous flagship silicon.
Oppo has stated that each model in the Find X9 series will carry an upgraded thermal management system to keep temperatures steady during prolonged use. This hardware refinement aims to ensure consistent speed across demanding sessions, promising users a device that performs smoothly even under strain.
The partnership between Oppo and MediaTek appears strategically timed, as both aim to showcase what flagship Android hardware can deliver heading into next year. With a new processor, enhanced cooling, and an aggressive rollout schedule, the Find X9 looks set to capture attention well beyond its launch markets.